HEAT DISSIPATION STRUCTURE FORMING MEMBER, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE

To provide a heat dissipation structure forming member, a method for manufacturing an electronic device, and an electronic device in which the heat dissipation structure can be formed by simple means.SOLUTION: A heat dissipation structure forming member 1 includes an adhesive layer 10 including thermally conductive particles 12 and an adhesive composition 14, and a metal foil layer 20 disposed on the adhesive layer 10. A method for manufacturing the electronic device 100, 200 includes a step of arranging at least one of the heat dissipation structure forming member 1 and electronic components 103, 201 such that the electronic components 103, 201 are in contact with the adhesive layer 10 of the heat dissipation structure forming member 1.SELECTED DRAWING: Figure 1 【課題】放熱構造を簡易な手段で形成することができる、放熱構造形成部材、電子装置の製造方法、及び、電子装置を提供する。【解決手段】放熱構造形成用部材１は、熱伝導性粒子１２及び接着剤組成物１４を含む接着剤層１０と、接着剤層１０上に配置される金属箔層２０と、を備える。電子装置１００，２００の製造方法は、放熱構造形成用部材１の接着剤層１０に電子部品１０３，２０１が接するように、放熱構造形成用部材１及び電子部品１０３，２０１の少なくとも一方を配置する工程を備える。【選択図】図１