SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

To reduce internal concentration due to temperature changes.SOLUTION: A sealing member 21 is filled into a storage area 16 g and includes a contact area 21a on its side that contacts an upper inner wall 16c to seal the semiconductor chip. In this case, a position of the contact area 21a of the sealing member 21 is closer to a semiconductor chip than the sealing surface 21b of the sealing member 21. In other words, a space 22 is formed between a sealing connection surface 21c of a corner of the sealing member 21 and a mounting area 16c2 of the upper inner wall 16c of a frame section 16. Thus, even if linear expansion coefficients of the sealing member 21 and the frame section 16 are different, stress concentration is suppressed because there are no sharp corners on an outer edge of the sealing member 21.SELECTED DRAWING: Figure 4 【課題】温度変化に伴う内部の集中を低減することができる。【解決手段】封止部材２１は、収納領域１６ｇに充填され、上部内壁１６ｃに接触する接触領域２１ａを側面に含み、半導体チップを封止する。この際、封止部材２１の接触領域２１ａの位置が封止部材２１の封止面２１ｂよりも半導体チップに近い。すなわち、封止部材２１の角部の封止接続面２１ｃと枠部１６の上部内壁１６ｃの取り付け領域１６ｃ２との間に空間２２が形成されている。このように封止部材２１と枠部１６との線膨張係数が異なっていても、封止部材２１の外縁部に尖った角部がないため、応力の集中が抑制される。【選択図】図４