RESIN SEALING DEVICE AND RESIN SEALING METHOD

To provide a resin sealing device and a resin sealing method, which are capable of preventing molding defects caused by a gradual decrease in a surface temperature of a sealing die when an automatic operation continues at a given cycle.SOLUTION: A resin sealing method according to the present invention is configured in that: a temperature of a sealing die 202 at which a resin R is appropriately thermally cured during sealing is defined as normal set temperature, and a temperature of the sealing die 202, which is set as a temperature higher than the normal set temperature by a predetermined temperature is defined as a switching set temperature; and during a unit process in which a workpiece W and the resin R are carried into the sealing die 202, sealed, and then carried out as a molded product Wp, a temperature of the sealing die 202 is controlled by changing the set temperature of at least one of an upper die 204 and a lower die 206 from the normal set temperature to the switching set temperature at a predetermined start timing, and a temperature of the sealing die 202 is controlled by changing the set temperature from the switching set temperature to the normal set temperature at a predetermined end timing.SELECTED DRAWING: Figure 1 【課題】一定周期の自動運転で継続する場合に、封止金型の表面温度が徐々に低下して成形不良が生じることの防止が可能な樹脂封止装置及び樹脂封止方法を提供する。【解決手段】本発明に係る樹脂封止方法は、封止時に樹脂Ｒを適切に熱硬化させる温度として設定される封止金型２０２の温度を通常設定温度とし、通常設定温度よりも所定温度高い温度として設定される封止金型２０２の温度を切替設定温度として、封止金型２０２へワークＷ及び樹脂Ｒを搬入して封止した後に成形品Ｗｐとして搬出する単位工程中において、上型２０４及び下型２０６の少なくとも一方を所定の開始タイミングで通常設定温度から切替設定温度に設定温度を高く変更して封止金型２０２の温度を制御し、所定の終了タイミングで切替設定温度から通常設定温度に設定温度を変更して封止金型２０２の温度を制御する構成である。【選択図】図１