SUBSTRATE PROCESSING SYSTEM AND CONVEYING METHOD
To provide a substrate processing system and a conveying method for selectively replacing consumable members having different replacement timings.SOLUTION: A plasma processing apparatus 1 comprises: a vacuum conveying module; a plasma processing module connected with the vacuum conveying module; and...
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| creator | AMIKURA NORIHIKO PARK GYEONG-MIN KITA MASATOMO MATSUURA SHIN SASAKI NOBUMINE MAKABE AKIYUKI |
| description | To provide a substrate processing system and a conveying method for selectively replacing consumable members having different replacement timings.SOLUTION: A plasma processing apparatus 1 comprises: a vacuum conveying module; a plasma processing module connected with the vacuum conveying module; and a control unit 90. The plasma processing module includes a plasma processing chamber 10, a stage that is arranged in the plasma processing chamber and has a substrate support surface and a ring support surface, a cover ring CR that is arranged on the ring support surface of the stage, an edge ring FR that is arranged on the cover ring to surround a substrate on the substrate support surface of the stage and has an inner diameter smaller than the inner diameter of the cover ring, a plurality of first support pins 521 that are arranged below the ring support surface, a plurality of second support pins 511 that are arranged below the substrate support surface, a first actuator 522 that moves the plurality of first support pins in the vertical direction, and a second actuator 512 that moves the plurality of second support pins in the vertical direction.SELECTED DRAWING: Figure 2
【課題】交換時期が異なる消耗部材を選択的に交換する基板処理システム及び搬送方法を提供する。【解決手段】真空搬送モジュールと、真空搬送モジュールに接続されるプラズマ処理モジュール及び制御部９０を備えるプラズマ処理装置１であって、プラズマ処理モジュールは、プラズマ処理チャンバ１０、プラズマ処理チャンバ内に配置され、基板支持面及びリング支持面を有するステージ、ステージのリング支持面上に配置されるカバーリングＣＲ、ステージの基板支持面上の基板を囲むようにカバーリング上に配置され、カバーリングの内径よりも小さい内径を有するエッジリングＦＲ、リング支持面の下方に配置される複数の第１支持ピン５２１、基板支持面の下方に配置される複数の第２支持ピン５１１、複数の第１支持ピンを縦方向に移動させる第１アクチュエータ５２２及び複数の第２支持ピンを縦方向に移動させる第２アクチュエータ５１２を含む。【選択図】図２ |
| format | Patent |
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【課題】交換時期が異なる消耗部材を選択的に交換する基板処理システム及び搬送方法を提供する。【解決手段】真空搬送モジュールと、真空搬送モジュールに接続されるプラズマ処理モジュール及び制御部９０を備えるプラズマ処理装置１であって、プラズマ処理モジュールは、プラズマ処理チャンバ１０、プラズマ処理チャンバ内に配置され、基板支持面及びリング支持面を有するステージ、ステージのリング支持面上に配置されるカバーリングＣＲ、ステージの基板支持面上の基板を囲むようにカバーリング上に配置され、カバーリングの内径よりも小さい内径を有するエッジリングＦＲ、リング支持面の下方に配置される複数の第１支持ピン５２１、基板支持面の下方に配置される複数の第２支持ピン５１１、複数の第１支持ピンを縦方向に移動させる第１アクチュエータ５２２及び複数の第２支持ピンを縦方向に移動させる第２アクチュエータ５１２を含む。【選択図】図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230816&DB=EPODOC&CC=JP&NR=2023113850A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230816&DB=EPODOC&CC=JP&NR=2023113850A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AMIKURA NORIHIKO</creatorcontrib><creatorcontrib>PARK GYEONG-MIN</creatorcontrib><creatorcontrib>KITA MASATOMO</creatorcontrib><creatorcontrib>MATSUURA SHIN</creatorcontrib><creatorcontrib>SASAKI NOBUMINE</creatorcontrib><creatorcontrib>MAKABE AKIYUKI</creatorcontrib><title>SUBSTRATE PROCESSING SYSTEM AND CONVEYING METHOD</title><description>To provide a substrate processing system and a conveying method for selectively replacing consumable members having different replacement timings.SOLUTION: A plasma processing apparatus 1 comprises: a vacuum conveying module; a plasma processing module connected with the vacuum conveying module; and a control unit 90. The plasma processing module includes a plasma processing chamber 10, a stage that is arranged in the plasma processing chamber and has a substrate support surface and a ring support surface, a cover ring CR that is arranged on the ring support surface of the stage, an edge ring FR that is arranged on the cover ring to surround a substrate on the substrate support surface of the stage and has an inner diameter smaller than the inner diameter of the cover ring, a plurality of first support pins 521 that are arranged below the ring support surface, a plurality of second support pins 511 that are arranged below the substrate support surface, a first actuator 522 that moves the plurality of first support pins in the vertical direction, and a second actuator 512 that moves the plurality of second support pins in the vertical direction.SELECTED DRAWING: Figure 2
【課題】交換時期が異なる消耗部材を選択的に交換する基板処理システム及び搬送方法を提供する。【解決手段】真空搬送モジュールと、真空搬送モジュールに接続されるプラズマ処理モジュール及び制御部９０を備えるプラズマ処理装置１であって、プラズマ処理モジュールは、プラズマ処理チャンバ１０、プラズマ処理チャンバ内に配置され、基板支持面及びリング支持面を有するステージ、ステージのリング支持面上に配置されるカバーリングＣＲ、ステージの基板支持面上の基板を囲むようにカバーリング上に配置され、カバーリングの内径よりも小さい内径を有するエッジリングＦＲ、リング支持面の下方に配置される複数の第１支持ピン５２１、基板支持面の下方に配置される複数の第２支持ピン５１１、複数の第１支持ピンを縦方向に移動させる第１アクチュエータ５２２及び複数の第２支持ピンを縦方向に移動させる第２アクチュエータ５１２を含む。【選択図】図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAIDnUKDglyDHFVCAjyd3YNDvb0c1cIjgwOcfVVcPRzUXD29wtzjQQJ-rqGePi78DCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeK8AIwMjY0NDYwtTA0djohQBAKMhJwI</recordid><startdate>20230816</startdate><enddate>20230816</enddate><creator>AMIKURA NORIHIKO</creator><creator>PARK GYEONG-MIN</creator><creator>KITA MASATOMO</creator><creator>MATSUURA SHIN</creator><creator>SASAKI NOBUMINE</creator><creator>MAKABE AKIYUKI</creator><scope>EVB</scope></search><sort><creationdate>20230816</creationdate><title>SUBSTRATE PROCESSING SYSTEM AND CONVEYING METHOD</title><author>AMIKURA NORIHIKO ; PARK GYEONG-MIN ; KITA MASATOMO ; MATSUURA SHIN ; SASAKI NOBUMINE ; MAKABE AKIYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023113850A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>AMIKURA NORIHIKO</creatorcontrib><creatorcontrib>PARK GYEONG-MIN</creatorcontrib><creatorcontrib>KITA MASATOMO</creatorcontrib><creatorcontrib>MATSUURA SHIN</creatorcontrib><creatorcontrib>SASAKI NOBUMINE</creatorcontrib><creatorcontrib>MAKABE AKIYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AMIKURA NORIHIKO</au><au>PARK GYEONG-MIN</au><au>KITA MASATOMO</au><au>MATSUURA SHIN</au><au>SASAKI NOBUMINE</au><au>MAKABE AKIYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING SYSTEM AND CONVEYING METHOD</title><date>2023-08-16</date><risdate>2023</risdate><abstract>To provide a substrate processing system and a conveying method for selectively replacing consumable members having different replacement timings.SOLUTION: A plasma processing apparatus 1 comprises: a vacuum conveying module; a plasma processing module connected with the vacuum conveying module; and a control unit 90. The plasma processing module includes a plasma processing chamber 10, a stage that is arranged in the plasma processing chamber and has a substrate support surface and a ring support surface, a cover ring CR that is arranged on the ring support surface of the stage, an edge ring FR that is arranged on the cover ring to surround a substrate on the substrate support surface of the stage and has an inner diameter smaller than the inner diameter of the cover ring, a plurality of first support pins 521 that are arranged below the ring support surface, a plurality of second support pins 511 that are arranged below the substrate support surface, a first actuator 522 that moves the plurality of first support pins in the vertical direction, and a second actuator 512 that moves the plurality of second support pins in the vertical direction.SELECTED DRAWING: Figure 2
【課題】交換時期が異なる消耗部材を選択的に交換する基板処理システム及び搬送方法を提供する。【解決手段】真空搬送モジュールと、真空搬送モジュールに接続されるプラズマ処理モジュール及び制御部９０を備えるプラズマ処理装置１であって、プラズマ処理モジュールは、プラズマ処理チャンバ１０、プラズマ処理チャンバ内に配置され、基板支持面及びリング支持面を有するステージ、ステージのリング支持面上に配置されるカバーリングＣＲ、ステージの基板支持面上の基板を囲むようにカバーリング上に配置され、カバーリングの内径よりも小さい内径を有するエッジリングＦＲ、リング支持面の下方に配置される複数の第１支持ピン５２１、基板支持面の下方に配置される複数の第２支持ピン５１１、複数の第１支持ピンを縦方向に移動させる第１アクチュエータ５２２及び複数の第２支持ピンを縦方向に移動させる第２アクチュエータ５１２を含む。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| title | SUBSTRATE PROCESSING SYSTEM AND CONVEYING METHOD |
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