FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD

To suppress degradation in film deposition quality when a plurality of layers are deposited in a film deposition apparatus.SOLUTION: A film deposition apparatus includes an evaporation source unit for depositing a film on a substrate while moving. The evaporation source unit includes a first evapora...

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Hauptverfasser: SUGAWARA YUKI, TAKEMI TAKASHI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To suppress degradation in film deposition quality when a plurality of layers are deposited in a film deposition apparatus.SOLUTION: A film deposition apparatus includes an evaporation source unit for depositing a film on a substrate while moving. The evaporation source unit includes a first evaporation source, a second evaporation source, and a third evaporation source that discharge vapor deposition materials, respectively. The first evaporation source, the second evaporation source, and the third evaporation source are aligned in order in a movement direction when the evaporation source unit deposits a film. A distance between the first evaporation source and the second evaporation source in the movement direction is greater than a distance between the second evaporation source and the third evaporation source in the movement direction.SELECTED DRAWING: Figure 6 【課題】成膜装置において複数層の成膜を行う際に成膜品質の低下を抑制すること【解決手段】成膜装置は、移動しながら基板に成膜する蒸発源ユニットを備える。蒸発源ユニットは、それぞれ蒸着物質を放出する第1の蒸発源、第2の蒸発源、及び第3の蒸発源を含む。蒸発源ユニットの成膜時の移動方向において、第1の蒸発源、第2の蒸発源、第3の蒸発源の順に並んでいる。移動方向における第1の蒸発源及び第2の蒸発源の間の距離は、移動方向における第2の蒸発源及び第3の蒸発源の間の距離よりも長い。【選択図】図6