COOLER AND SEMICONDUCTOR DEVICE

To provide a technique capable of restraining brazing material from clogging at an opening of a pipeline which is adjacent to a heating element and through which a coolant flows.SOLUTION: A cooler 200 includes a header 240 fixed to one ends of cooling pipes 222 and 224 and a cooling pipe 226 which are adjacent to the semiconductor packages 100 and through which cooling water flows, and a water inlet pipe 210 and a water outlet pipe 230 for supplying and discharging cooling water to and from the header 240. The header 240 has an inner wall portion 241B that compartments the inside thereof into a space SP1 for making the cooling pipes 222, 224 and the water inlet pipe 210 communicate with each other, and a space SP2 for making the cooling pipe 226 and the water outlet pipe 230 communicate with each other, and outer wall portions 242 and 243 that are brazed with a predetermined member by using a clad material. The inner wall portion 241B includes inner wall portions 241B1 to 241B3 that slope away from openings at one ends of the cooling pipes 222, 224 or the cooling pipe 226 as they go downward in a posture state of a bonding step.SELECTED DRAWING: Figure 14 【課題】発熱体に隣接し冷媒が通流する管路の開口のロウ材による閉塞を抑制することが可能な技術を提供する。【解決手段】本開示の一実施形態に係る冷却器２００は、半導体パッケージ１００と隣接し冷却水が内部を通流する冷却管２２２，２２４及び冷却管２２６の一端が固定されるヘッダ２４０と、ヘッダ２４０への冷却水の給排を行う入水管２１０及び出水管２３０と、を備える。ヘッダ２４０は、その内部を、冷却管２２２，２２４及び入水管２１０の間を連通させる空間ＳＰ１と冷却管２２６及び出水管２３０の間を連通させる空間ＳＰ２とに区画する内壁部２４１Ｂと、クラッド材が用いられることで所定の部材とロウ付けされている外壁部２４２，２４３と、を有し、内壁部２４１Ｂは、接合工程の姿勢状態において、下に向かうにつれて冷却管２２２，２２４或いは冷却管２２６の一端の開口から離れるように傾斜する内壁部２４１Ｂ１～２４１Ｂ３を含む。【選択図】図１４