JET FLOW TYPE PLATING DEVICE

To provide a nozzle structure for a jet type plating tank, having a simple structure, capable of being installed in a space-saving manner at low cost, and capable of promoting a film thickness growth by dispersing and uniforming a plating solution in the plating tank by jetting the plating solution...

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Bibliographische Detailangaben
1. Verfasser:	FURUSAWA TAKAYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a nozzle structure for a jet type plating tank, having a simple structure, capable of being installed in a space-saving manner at low cost, and capable of promoting a film thickness growth by dispersing and uniforming a plating solution in the plating tank by jetting the plating solution substantially uniformly onto a surface of a semiconductor wafer.SOLUTION: A nozzle structure of a jet type plating tank has multiple jet channels formed at an opening of a plating solution jet nozzle, wherein the plating solution jetted from an end opening of each jet channel disperses and uniforms the plating solution in the plating tank.SELECTED DRAWING: Figure 1 【課題】簡素な構造で、低コストで省スペースに設置することができ、半導体ウェハ表面に略均一にめっき液を噴流させてめっき槽内のめっき液の分散化及び均一化を行い膜厚成長を促すことができる噴流式めっき槽のノズル構造を提供する。【解決手段】めっき液噴出ノズルの開口部に複数の噴流路を形成し、各噴流路の終端開口部から噴流されるめっき液によりめっき槽内のめっき液の分散化及び均一化を行うことを特徴とする噴流式めっき槽のノズル構造とした。【選択図】図１