MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE

To prevent impurities from mixing into a wafer and to prevent gas distribution resistance from increasing in a member for a semiconductor manufacturing device including porous plugs that permit gas distribution.SOLUTION: A member 10 for a semiconductor manufacturing device includes a ceramic plate 20 having a wafer mounting surface 21 on its upper surface and porous plugs 50 that allow gas to pass therethrough. The porous plugs 50 are placed in plug insertion holes 24 that penetrate the ceramic plate 20 in the vertical direction. The porous plugs 50 have first porous portions 51 exposed on the wafer mounting surface 21 and second porous portions 52 whose upper surfaces are covered by the first porous portions 51. The first porous portions 51 are purer and thinner than the second porous portions 52. The second porous portions 52 have a higher porosity than that of the first porous portions 51.SELECTED DRAWING: Figure 1 【課題】ガスの流通を許容する多孔質プラグを備えた半導体製造装置用部材において、不純物がウエハに混入するのを抑制すると共にガスの流通抵抗が大きくなるのを抑制する。【解決手段】半導体製造装置用部材１０は、上面にウエハ載置面２１を有するセラミックプレート２０と、ガスの流通を許容する多孔質プラグ５０とを備える。多孔質プラグ５０は、セラミックプレート２０を上下方向に貫通するプラグ挿入穴２４に配置される。多孔質プラグ５０は、ウエハ載置面２１に露出する第１多孔質部５１と、第１多孔質部５１によって上面が覆われている第２多孔質部５２とを有する。第１多孔質部５１は、第２多孔質部５２に比べて純度が高くて厚みが薄い。第２多孔質部５２は、第１多孔質部５１に比べて気孔率が高い。【選択図】図１