5-MEMBERED FUSED-RING COMPOUND AND METHOD FOR PRODUCING THE SAME, CURABLE COMPOSITION, CURED PRODUCT, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR SEALANT AND SEMICONDUCTOR DEVICE

To provide a 5-membered fused-ring compound having low dielectric loss tangents and excellent heat resistance in a well-balanced manner.SOLUTION: A 5-membered fused-ring compound has a structural unit represented by the formula (0). (M1 is a divalent group represented by the formula (1), and A is a...

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Bibliographische Detailangaben
Hauptverfasser:	HAYASHI HIROSHI, KIM YOUNGAN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a 5-membered fused-ring compound having low dielectric loss tangents and excellent heat resistance in a well-balanced manner.SOLUTION: A 5-membered fused-ring compound has a structural unit represented by the formula (0). (M1 is a divalent group represented by the formula (1), and A is a substituted/unsubstituted arylene group).SELECTED DRAWING: None 【課題】低誘電正接及び優れた耐熱性を高次に両立可能な５員環縮合環化合物の提供。【解決手段】式（０）で表される構造単位を有する５員環縮合環化合物である。（Ｍ１は式（１）で表される２価の基、Ａは置換／非置換のアリーレン基である。）TIFF2023104784000035.tif32153TIFF2023104784000036.tif39153【選択図】なし