BONDING PLAN AUTOMATIC FORMATION METHOD

To provide a bonding plan automatic formation method capable, responding to a situation, of appropriately regulating a loss amount attributed to a production time increase based on a sheet length of a corrugated board sheet and a loss amount attributed to a change of order information.SOLUTION: A bo...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SASAKI HIROSHI, OSHIMA FUMIO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD ORMATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PERFORMING OPERATIONS PHYSICS REGULATING TRANSPORTING WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a bonding plan automatic formation method capable, responding to a situation, of appropriately regulating a loss amount attributed to a production time increase based on a sheet length of a corrugated board sheet and a loss amount attributed to a change of order information.SOLUTION: A bonding plan automatic formation method includes: a step S1 of acquiring plural pieces of order information R; a step S2 of selecting to either perform a total loss amount regulating mode or perform a sheet length regulating mode; and a step S4 of forming, based on the selected total loss amount regulating mode or sheet length regulating mode, a bonding plan which is an aggregate of bondable rots Rt1.SELECTED DRAWING: Figure 12 【課題】状況に応じて、段ボールシートのシート長さに基づく製造時間の増大に起因する損失金額および受注情報の変更に起因する損失金額を適切に抑制することが可能な貼合計画自動作成方法を提供する。【解決手段】この貼合計画自動作成方法は、複数の受注情報Ｒを取得するステップＳ１と、総損失金額抑制モードを行うか、または、シート長さ抑制モードを行うかを選択するステップＳ２と、選択された総損失金額抑制モードまたはシート長さ抑制モードに基づいて、貼合可能ロットＲｔ１の集合である貼合計画を作成するステップＳ４とを備える。【選択図】図１２