RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, METHOD FOR PRODUCING RESIN COMPOSITION AND RESIN

To provide a resin composition having excellent dielectric properties and low thermal expansion properties, a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition, a method for producing the resin composition and a resin.SOLUTION: There ar...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAKIYA MINORU, HORIE AKIRA, TAKEGUCHI AYAKA, SATO NAOYOSHI, AKEBI RYUJI, AITSU SHUJI, TANIGAWA TAKAO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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