RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, METHOD FOR PRODUCING RESIN COMPOSITION AND RESIN

To provide a resin composition having excellent dielectric properties and low thermal expansion properties, a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition, a method for producing the resin composition and a resin.SOLUTION: There ar...

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Hauptverfasser:	KAKIYA MINORU, HORIE AKIRA, TAKEGUCHI AYAKA, SATO NAOYOSHI, AKEBI RYUJI, AITSU SHUJI, TANIGAWA TAKAO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Zusammenfassung:	To provide a resin composition having excellent dielectric properties and low thermal expansion properties, a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition, a method for producing the resin composition and a resin.SOLUTION: There are provided: a resin composition comprising (A) a resin containing a structural unit derived from a maleimide resin having one or more N-substituted maleimide groups and a structural unit derived from an aromatic vinyl compound and (B) a thermoplastic resin; a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition; a method for producing the resin composition; and a resin.SELECTED DRAWING: None 【課題】誘電特性及び低熱膨張性に優れる樹脂組成物、該樹脂組成物を用いたプリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ、樹脂組成物の製造方法、並びに樹脂を提供する。【解決手段】（Ａ）Ｎ－置換マレイミド基を１個以上有するマレイミド樹脂由来の構造単位と、芳香族ビニル化合物由来の構造単位と、を含む樹脂と、（Ｂ）熱可塑性樹脂と、を含有する、樹脂組成物、該樹脂組成物を用いたプリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ、樹脂組成物の製造方法、並びに樹脂である。【選択図】なし