PROCESSING DEVICE

To prevent breakage of a rotary joint in a processing device.SOLUTION: The present invention relates to a grinding device 1 comprising: a mechanism 35 for rotating a table 3 on which a wafer is sucked and held; and a rotary joint 40 connected to a rotary shaft 350 of the table rotation mechanism 35. The table 3 includes: a center sucking plate 30 which sucks a center of the wafer; an outer periphery sucking plate 32 which encloses the center sucking plate 30 and sucks an outer peripheral portion of the wafer; an annular partition part 34 disposed between the center sucking plate 30 and the outer periphery sucking plate 32; and a frame body 31 in which the center sucking plate 30, the partition part 34 and the outer periphery sucking plate 32 are stored. The frame body 31 includes: a center suction path 37 which communicates a suction source 42 to the center sucking plate 30 and passes the rotary joint 40; and an outer periphery suction path 39 communicating with the outer periphery sucking plate 32. The grinding device comprises a ring member 50 which surrounds the frame body 31 with a clearance 500 outside the frame body and does not rotate, and a communication path 51 which is formed in the ring member 50 and communicates a suction source 52 with the outer periphery suction path 39 with no contact via the clearance 500.SELECTED DRAWING: Figure 1 【課題】加工装置におけるロータリージョイントの破損防止。【解決手段】ウェーハを吸引保持するテーブル３を回転する機構３５と、テーブル回転機構３５の回転軸３５０に接続されたロータリージョイント４０と、を備え、テーブル３は、ウェーハ中央を吸引する中央吸引板３０と、中央吸引板３０を囲みウェーハ外周部分を吸引する外周吸引板３２と、中央吸引板３０と外周吸引板３２との間に配設される環状の仕切り部３４と、中央吸引板３０と仕切り部３４と外周吸引板３２とを収容する枠体３１と、を備え、枠体３１は、中央吸引板３０に吸引源４２を連通させロータリージョイント４０を通過する中央吸引路３７と、外周吸引板３２に連通させる外周吸引路３９とを備え、枠体３１の外側に隙間５００を空け囲み回転しないリング部材５０と、リング部材５０に形成し隙間５００を介し非接触で外周吸引路３９に吸引源５２を連通させる連通路５１と、を備える研削装置１。【選択図】図１