PROCESSOR SYSTEM, SEMICONDUCTOR INSPECTION SYSTEM, AND PROGRAM

To provide a technique capable of quantitatively grasping a change in a three-dimensional shape including a cross-sectional shape of a pattern in a wafer plane or between wafers non-destructively before performing cross-sectional observation.SOLUTION: A processor system of a semiconductor inspection...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OSAKI MAYUKA, KOJIMA TAKEKI, YASUI KENJI, NAMAI HITOSHI, NAGATOMO WATARU, IKODA MASAMI, KIMURA MAKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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