SURFACE TREATMENT FILM

To provide a surface treatment film whose fracture is suppressed, regardless of having a thin base material layer.SOLUTION: A surface treatment film includes a base material layer having a thickness of less than 20 μm, a coating layer provided on a surface of the base material layer, and a first end...

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Bibliographische Detailangaben
Hauptverfasser:	OKADA TOMOHIRO, SOFUE SHOJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a surface treatment film whose fracture is suppressed, regardless of having a thin base material layer.SOLUTION: A surface treatment film includes a base material layer having a thickness of less than 20 μm, a coating layer provided on a surface of the base material layer, and a first end portion having a tear strength of 0.5 N or more at a temperature of 23°C and a relative humidity of 55%.SELECTED DRAWING: Figure 1 【課題】厚みの小さい基材層を有しながらも破断が抑制された表面処理フィルムを提供する。【解決手段】表面処理フィルムは、厚みが２０μｍ未満である基材層と、基材層表面に設けられた塗工層と、温度２３℃、相対湿度５５％における引裂き強度が０．５Ｎ以上である第１端部と、を有する。【選択図】図１