LAMINATED ELECTRONIC COMPONENT

To provide a laminated electronic component with improved capacity per unit volume.SOLUTION: A laminated electronic component 1000 includes: a main body 110 with first to sixth surfaces; first and second external electrodes 131 and 132 each of which includes a first (second) connection part 131a (132a) arranged on the third (fourth) surface, a first (second) band part 131b (132b) extended from the first (second) connection part to a part of the first (second) surface, and a third (fourth) band part 131c (132c) extended from the first (second) connection part to a part of the second surface; an insulating layer 151 arranged on the first and second connection parts so as to cover the second surface and the third and fourth band parts; a first plating layer 141 arranged on the first band part; and a second plating layer 142 arranged on the second band part. End parts of the first and second plating layers and an end part of the insulating layer are arranged in contact with each other at a contact on the first and second external electrodes. A thickness of the end parts of the insulating layer and the plating layers decreases toward the contact.SELECTED DRAWING: Figure 3 【課題】単位体積当たりの容量が向上した積層型電子部品を提供する。【解決手段】積層型電子部品１０００は、第１面～第６面を有する本体１１０と、第３（４）面に配置される第１（２）接続部１３１ａ（１３２ａ）、第１（２）接続部から第１（２）面の一部まで延びる第１（２）バンド部１３１ｂ（１３２ｂ）及び第１（２）接続部から第２面の一部まで延びる第３（４）バンド部１３１ｃ（１３２ｃ）を含む第１（２）外部電極１３１（１３２）と、第１接続部及び第２接続部上に配置され、第２面、第３及び第４バンド部を覆うように配置される絶縁層１５１と、第１バンド部上に配置される第１めっき層１４１と、第２バンド部上に配置される第２めっき層１４２と、を含む。第１めっき層及び第２めっき層の端部と絶縁層の端部は、第１外部電極及び第２外部電極上の接点で互いに接するように配置され、絶縁層及びめっき層の端部は、接点に向かって厚さが減少する。【選択図】図３