SEMICONDUCTOR MANUFACTURING DEVICE, INSPECTION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR

To provide a technique that can improve the accuracy of detecting flaws.SOLUTION: A semiconductor manufacturing device comprises: an imaging device that picks up an image of a die; an illuminating device that has a light source being a point light source or a line light source; and a control unit th...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	KOBASHI HIDEHARU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a technique that can improve the accuracy of detecting flaws.SOLUTION: A semiconductor manufacturing device comprises: an imaging device that picks up an image of a die; an illuminating device that has a light source being a point light source or a line light source; and a control unit that uses the light source to irradiate a part of the die with light to form a bright field area on the die, and repeats moving the bright field area and imaging the die at a predetermined pitch to perform inspection inside the bright field area.SELECTED DRAWING: Figure 10 【課題】傷の検出精度を向上させることが可能な技術を提供することである。【解決手段】半導体製造装置は、ダイを撮像する撮像装置と、点光源または線光源である光源を有する照明装置と、光源によりダイの一部に対して光を照射して明視野領域をダイ上に形成し、所定ピッチでの明視野領域の移動とダイの撮像とを繰り返して明視野領域内を検査するよう構成される制御部と、を備える。【選択図】図１０