FILM THICKNESS MEASUREMENT METHOD AND FILM THICKNESS MEASUREMENT DEVICE

To provide a film thickness measurement method that substantially widens a wavelength range of reflected light spectrum from a work-piece, and can measure an accurate film thickness.SOLUTION: According to a film thickness measurement method, a work-piece W is pressed against an abrasive pad 2 and is...

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Hauptverfasser: KINOSHITA MASATAKA, SHIOKAWA YOICHI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a film thickness measurement method that substantially widens a wavelength range of reflected light spectrum from a work-piece, and can measure an accurate film thickness.SOLUTION: According to a film thickness measurement method, a work-piece W is pressed against an abrasive pad 2 and is polished while rotating a polishing table 3 which supports the abrasive pad 2, light is guided to the work-piece W from a liquid seal sensor 25 and a transparent window sensor 31 which are located on the polishing table 3 during polishing of the work-piece W, reflected light from the work-piece W is received by the liquid seal sensor 25 and the transparent window sensor 31, and a film thickness of the work-piece W is determined on the basis of reflected light spectrum from the work-piece W.SELECTED DRAWING: Figure 3 【課題】ワークピースからの反射光のスペクトルの波長範囲を実質的に広げ、正確な膜厚を測定することができる膜厚測定方法を提供する。【解決手段】膜厚測定方法は、研磨パッド2を支持する研磨テーブル3を回転させながら、ワークピースWを研磨パッド2に押し付けてワークピースWを研磨し、ワークピースWの研磨中に、研磨テーブル3に配置された液封式センサ25および透明窓式センサ31から光をワークピースWに導き、かつワークピースWからの反射光を液封式センサ25および透明窓式センサ31で受け、ワークピースWからの反射光のスペクトルに基づいてワークピースWの膜厚を決定する。【選択図】図3