ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE AND PRODUCING METHOD OF CONNECTION STRUCTURE

To provide an adhesive composition usable also for connection that requires higher adhesion strength due to substrate difference such as FOG or COG mounting, and excellent in dispersibility of conductive particles and connection reliability.SOLUTION: An adhesive composition of the present invention comprises a binder composition containing a polymerizable component and a film-forming component, a polymerization initiator, conductive particles having a particle size of 1 μm or more and 10 μm or less, an insulating filler having a particle size of 5% or less of the conductive particles, and a silane-coupling agent, wherein the blending amount of the insulating filler is 85 mass% or more and 200 mass% or less of the conductive particles.SELECTED DRAWING: None 【課題】ＦＯＧやＣＯＧ実装等の基材違いにより高い接着強度が必要とされる接合にも使用可能であり、導電性粒子の分散性および接続信頼性に優れる接着剤組成物を提供する。【解決手段】本発明の接着剤組成物は、重合性成分と成膜用成分を含有するバインダ組成物と、重合開始剤と、粒子径が１μｍ以上１０μｍ以下の導電性粒子と、粒子径が前記導電性粒子の５％以下である絶縁性フィラーと、シランカップリング剤と、を含み、前記絶縁性フィラーの配合量が前記導電性粒子の８５質量％以上２００質量％以下である。【選択図】なし