THICKNESS MEASURING DEVICE AND METHOD FOR MEASURING THICKNESS

To reduce the influence of the temperature of a measurement environment in a measurement of the thickness of a target object.SOLUTION: A thickness measuring device 10 includes: an excitation unit 71 for applying an excitation current to an excitation coil 11 and inducing an eddy current in a target...

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1. Verfasser: TOKIOKA YOSHINORI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To reduce the influence of the temperature of a measurement environment in a measurement of the thickness of a target object.SOLUTION: A thickness measuring device 10 includes: an excitation unit 71 for applying an excitation current to an excitation coil 11 and inducing an eddy current in a target object 9; a detection unit 72 for detecting an eddy current in the target object 9 by a detection coil 12; a thickness deriving unit 84 for determining the thickness d of the target object 9 on the basis of the duration time τ of the eddy current detected by the detection unit 72; a substrate 68 equipped with the excitation unit 71 and the detection unit 72; and a correction unit 85 for correcting a thickness d. The correction unit 85 corrects the thickness d on the basis of the temperature characteristics of the duration time τ related to the temperature of the substrate 68 and the temperature of the excitation coil 11.SELECTED DRAWING: Figure 3 【課題】対象物の厚さ測定において測定環境の温度の影響を低減する。【解決手段】厚さ測定装置10は、励磁コイル11に励磁電流を印加して対象物9に渦電流を誘起させる励磁部71と、対象物9の渦電流を検出コイル12を介して検出する検出部72と、検出部72によって検出された渦電流の継続時間τに基づいて対象物9の厚さdを求める厚さ導出部84と、励磁部71及び検出部72が実装された基板68と、厚さdを補正する補正部85とを備えている。補正部85は、基板68の温度及び励磁コイル11の温度に関する継続時間τの温度特性に基づいて厚さdを補正する。【選択図】図3