THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

To provide a thermosetting resin composition which can improve a dielectric loss tangent (Df), and a prepreg, a resin film, a laminated plate, a printed wiring board and a semiconductor package, which are obtained by using the thermosetting resin composition.SOLUTION: A thermosetting resin compositi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MURATA YUTA, KAKIYA MINORU, HATAKEYAMA NENE, TAKEGUCHI AYAKA, SATO NAOYOSHI, FUKUI MASATO, AKEBI RYUJI, OTSUKA KOHEI, TANIGAWA TAKAO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MAKING GRANULES OR PREFORMS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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