THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

To provide a thermosetting resin composition which can improve a dielectric loss tangent (Df), and a prepreg, a resin film, a laminated plate, a printed wiring board and a semiconductor package, which are obtained by using the thermosetting resin composition.SOLUTION: A thermosetting resin compositi...

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Bibliographische Detailangaben
Hauptverfasser:	MURATA YUTA, KAKIYA MINORU, HATAKEYAMA NENE, TAKEGUCHI AYAKA, SATO NAOYOSHI, FUKUI MASATO, AKEBI RYUJI, OTSUKA KOHEI, TANIGAWA TAKAO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MAKING GRANULES OR PREFORMS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	To provide a thermosetting resin composition which can improve a dielectric loss tangent (Df), and a prepreg, a resin film, a laminated plate, a printed wiring board and a semiconductor package, which are obtained by using the thermosetting resin composition.SOLUTION: A thermosetting resin composition contains (A) a thermosetting resin and (B) an inorganic filler, wherein (B) the inorganic filler has D10/D50 of 0.70 or more, when a particle diameter corresponding to cumulative 10 vol.% is represented by D10 and a particle diameter corresponding to cumulative 50 vol.% is represented by D50, from the small particle diameter side in a particle cumulative particle size distribution.SELECTED DRAWING: None 【課題】誘電正接（Ｄｆ）を改善し得る熱硬化性樹脂組成物を提供すること、並びに、当該熱硬化性樹脂組成物を用いて得られる、プリプレグ、樹脂フィルム、積層板、プリント配線板、及び半導体パッケージを提供すること。【解決手段】（Ａ）熱硬化性樹脂及び（Ｂ）無機充填材を含有する熱硬化性樹脂組成物であって、前記（Ｂ）無機充填材は、粒子の累積粒度分布において粒子径が小さい方から累積１０体積％に相当する粒子径をＤ１０、累積５０体積％に相当する粒子径をＤ５０と表したとき、Ｄ１０／Ｄ５０が０．７０以上である、熱硬化性樹脂組成物。【選択図】なし