EPOXY RESIN COMPOSITION AND CURED PRODUCT

To provide an epoxy resin composition that gives a cured product having excellent high temperature properties, such as heat resistance, heat transfer rate, and high temperature elastic modulus, and further provide a cured product including the same.SOLUTION: An epoxy resin composition comprises an e...

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Hauptverfasser:	KAJI MASASHI, OGAMI KOICHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide an epoxy resin composition that gives a cured product having excellent high temperature properties, such as heat resistance, heat transfer rate, and high temperature elastic modulus, and further provide a cured product including the same.SOLUTION: An epoxy resin composition comprises an epoxy resin and a curing agent. The epoxy resin composition gives a crystalline cured product by using, as an epoxy resin component, a bifunctional epoxy resin represented by the general formula (1) and, as curing agent components, a bifunctional phenolic compound and a polyfunctional phenolic resin.SELECTED DRAWING: None 【課題】耐熱性、熱伝導率、高温弾性率等の高温特性に優れた硬化物を与えるエポキシ樹脂組成物を提供し、更にそれを用いた硬化物を提供する。【解決手段】エポキシ樹脂及び硬化剤よりなるエポキシ樹脂組成物において、エポキシ樹脂成分として、下記一般式（１）、TIFF2023093972000012.tif25167で表される二官能エポキシ樹脂を用い、硬化剤成分として、二官能フェノール化合物および多官能フェノール樹脂を用いる、結晶性の硬化物を与えるエポキシ樹脂組成物である。【選択図】なし