METHOD FOR PRODUCING CURED PRODUCT LAYER, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT USING THE SAME

To provide a method for producing a cured product layer of a thermosetting resin composition which prevents exposure of an inorganic filler and fall-off on a surface of a cured product layer roughened by desmear treatment, and suppresses generation of a gap between a substrate and the cured product...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AOYAMA YOSHITOMO, NAKADA KAZUKI, KAN SHU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!