METHOD FOR PRODUCING CURED PRODUCT LAYER, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT USING THE SAME

To provide a method for producing a cured product layer of a thermosetting resin composition which prevents exposure of an inorganic filler and fall-off on a surface of a cured product layer roughened by desmear treatment, and suppresses generation of a gap between a substrate and the cured product...

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Bibliographische Detailangaben
Hauptverfasser:	AOYAMA YOSHITOMO, NAKADA KAZUKI, KAN SHU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a method for producing a cured product layer of a thermosetting resin composition which prevents exposure of an inorganic filler and fall-off on a surface of a cured product layer roughened by desmear treatment, and suppresses generation of a gap between a substrate and the cured product layer in the outer peripheral part of a via bottom, and a method for manufacturing a printed wiring board and a method for manufacturing an electronic component using the same.SOLUTION: A method for producing a cured product layer includes: a desmear step of subjecting the surface of a cured product layer composed of a cured product of a thermosetting resin composition to desmear treatment; and a heat treatment step of heat-treating the cured product layer after the desmear treatment at 110°C or higher for 10 minutes or longer. The thermosetting resin composition contains an epoxy resin, an active ester compound, and an inorganic filler.SELECTED DRAWING: None 【課題】デスミア処理により粗面化した硬化物層表面を無機充填剤の露出や脱落等のないものとし、さらにビア底の外周部における基板と硬化物層との隙間の発生が抑制された熱硬化性樹脂組成物の硬化物層を製造する方法、これを用いたプリント配線板の製造方法および電子部品の製造方法を提供する。【解決手段】硬化物層の製造方法は、熱硬化性樹脂組成物の硬化物から構成された硬化物層の表面をデスミア処理するデスミア工程と、デスミア工程後の硬化物層を１１０℃以上で１０分以上熱処理する熱処理工程と、を含む。熱硬化性樹脂組成物は、エポキシ樹脂と、活性エステル化合物と、無機充填剤と、を含む。【選択図】なし