RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE

To provide a resin composition which can achieve both a high glass transition temperature and good toughness, an electronic component device obtained by using the resin composition, and a method for manufacturing an electronic component device using the resin composition.SOLUTION: A resin compositio...

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Hauptverfasser:	FUSUMADA MITSUAKI, NEGORO SHUHEI, UCHIYAMA CHIKA, SAITO TAKESHI, SHIRAKAMI MASASHI, FURUIKE DAIKI, KAMIMURA KAZUYA, SAITO TAKAHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a resin composition which can achieve both a high glass transition temperature and good toughness, an electronic component device obtained by using the resin composition, and a method for manufacturing an electronic component device using the resin composition.SOLUTION: A resin composition contains an epoxy resin, a curing agent, and a curing accelerator, wherein a glass transition temperature of a cured product is 150°C or higher, and the curing accelerator does not contain a functional group reacting with an epoxy group.SELECTED DRAWING: None 【課題】高いガラス転移温度と良好な靭性を両立しうる樹脂組成物、この樹脂組成物を用いて得られる電子部品装置、及びこの樹脂組成物を用いる電子部品装置の製造方法の提供。【解決手段】エポキシ樹脂と、硬化剤と、硬化促進剤と、を含有し、硬化物のガラス転移温度が１５０℃以上であり、前記硬化促進剤がエポキシ基と反応する官能基を含まない、樹脂組成物。【選択図】なし