SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

To prevent a liquid from being deposited to a substrate again in a case where the liquid is removed from the substrate by a processing fluid.SOLUTION: A substrate processing device comprises: a processing chamber including a processing space for processing a substrate; a support part which is stored in the processing space while supporting the substrate in a horizontal posture; a fluid supply part which causes a processing fluid to flow in a fixed direction in the processing space by supplying the processing fluid to the processing chamber; and a fluid discharge part which discharges the processing fluid from the processing chamber. The support part includes a substrate opposite surface opposed to a bottom face of the substrate and supports the substrate in a state where the substrate is separated upward from the substrate opposite surface. In a path of a layer flow of the processing fluid flowing between the substrate and the support part in the processing fluid, a downstream path positioned at a downstream side in the fixed direction is wider than an upstream path positioned at an upstream side in the fixed direction.SELECTED DRAWING: Figure 3 【課題】処理流体によって基板から液体を除去した際に、当該液体が基板に再付着するのを防止する。【解決手段】この発明は、基板を処理するための処理空間を有する処理チャンバと、基板を水平姿勢で支持しながら処理空間に収容される支持部と、処理チャンバに処理流体を供給することで、処理空間において処理流体を一定方向に流動させる流体供給部と、処理チャンバから処理流体を排出する流体排出部と、を備えている。支持部は、基板の下面と対向する基板対向面を有し、基板を基板対向面から上方に離間させた状態で支持し、処理流体のうち基板と支持部との間を流れる処理流体の層流の経路では、一定方向の下流側に位置する下流経路が一定方向の上流側に位置する上流経路よりも広くなっている。【選択図】図３