POLYIMIDE FILM AND METHOD FOR PRODUCING THE SAME, RESIN COMPOSITION, METAL-CLAD LAMINATE AND METHOD FOR MANUFACTURING THE SAME, AND FLEXIBLE PRINTED BOARD
To provide a polyimide film which can be used as a flexible printed board for high frequency.SOLUTION: A polyimide film has a structural unit including a tetracarboxylic acid residue having an ester group or a diamine residue having an ester group, has a dielectric loss tangent of less than 0.0040,...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | To provide a polyimide film which can be used as a flexible printed board for high frequency.SOLUTION: A polyimide film has a structural unit including a tetracarboxylic acid residue having an ester group or a diamine residue having an ester group, has a dielectric loss tangent of less than 0.0040, a coefficient of linear expansion of less than 15 ppm/°C, and a haze of less than 20%. A polyimide film has a structural unit including a tetracarboxylic acid residue having an ester group or a diamine residue having an ester group, has a dielectric constant of less than 3.5, a dielectric loss tangent of less than 0.0035, and a coefficient of linear expansion of less than 20 ppm/°C.SELECTED DRAWING: None
【課題】高周波用フレキシブルプリント基板などとして利用しうるポリイミドフィルムを提供する。【解決手段】エステル基を有するテトラカルボン酸残基またはエステル基を有するジアミン残基を含む構造単位を有し、誘電正接が0.0040未満であり、線膨張係数が15ppm/℃未満であり、ヘイズが20%未満であるポリイミドフィルム。またはエステル基を有するテトラカルボン酸残基またはエステル基を有するジアミン残基を含む構造単位を有し、誘電率が3.5未満、誘電正接が0.0035未満であり、線膨張係数が20ppm/℃未満であるポリイミドフィルム。【選択図】 なし |
---|