HEAT-CURABLE COMPOSITION, ADHESIVE SHEET, PRINTED WIRING BOARD, AND ELECTRONIC APPLIANCE

To provide a heat-curable composition that allows easy lamination to an LCP substrate and is cured to give a cured product having superior alkali resistance and acid resistance, and also having superior insulation reliability after a heat cycle test, and to provide an adhesive sheet, and a printed w...

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Bibliographische Detailangaben
Hauptverfasser:	USA YUKI, SAKAGUCHI GO, WADA HIDEKI, WAKATABE SATOSHI, SONEDA YUJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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