HEAT-CURABLE COMPOSITION, ADHESIVE SHEET, PRINTED WIRING BOARD, AND ELECTRONIC APPLIANCE

To provide a heat-curable composition that allows easy lamination to an LCP substrate and is cured to give a cured product having superior alkali resistance and acid resistance, and also having superior insulation reliability after a heat cycle test, and to provide an adhesive sheet, and a printed w...

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Hauptverfasser: USA YUKI, SAKAGUCHI GO, WADA HIDEKI, WAKATABE SATOSHI, SONEDA YUJI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a heat-curable composition that allows easy lamination to an LCP substrate and is cured to give a cured product having superior alkali resistance and acid resistance, and also having superior insulation reliability after a heat cycle test, and to provide an adhesive sheet, and a printed wiring board.SOLUTION: A heat-curable composition comprises: a polyimide resin (A) which has a repeating unit of a general formula (1), includes a phenolic hydroxyl group, and has a storage modulus G' of 1.0×107 Pa at a temperature of 30-90°C, with at least some of X2 including residues X2d derived from a dimer diamine, etc.; and a crosslinking agent (B) having two or more functional groups.SELECTED DRAWING: Figure 1 【課題】LCP基材へのラミネート性に優れ、本組成物の硬化により、耐アルカリ性および酸耐性に優れ、且つヒートサイクル試験後の絶縁信頼性に優れる硬化物が得られる熱硬化性組成物、接着シートおよびプリント配線板を提供する。【解決手段】熱硬化性組成物は、一般式(1):TIFF2023087643000027.tif40102の繰り返し単位を有し、フェノール性水酸基を有し、貯蔵弾性率G'が1.0×107Paとなる温度が30~90℃にあり、X2の少なくとも一部はダイマージアミン等に由来する残基X2dを有するポリイミド樹脂(A)と2以上の官能基を有する架橋剤(B)とを有する。【選択図】図1