BONDING WIRE AND SEMICONDUCTOR DEVICE

To provide a bonding wire superior in long-term reliability, which can achieve a satisfactory circular form as to FAB shape when FAB is put in contact with an electrode and crushed.SOLUTION: In a semiconductor device M, a bonding wire W comprises: 0.005 mass% or more and 2.0 mass% or less of In; one...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TANAHASHI AKIRA, TAKIGAWA YOSHIMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!