WIRING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

To improve the overall transparency without impairing the degree of freedom of a wiring pattern of a wired circuit board.SOLUTION: A wired circuit board 100 includes: a transparent substrate 10; a first terminal portion 60 formed on the transparent substrate 10; a second terminal portion 70 formed o...

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Bibliographische Detailangaben
Hauptverfasser:	TSUDA NAO, INOUE MAYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	To improve the overall transparency without impairing the degree of freedom of a wiring pattern of a wired circuit board.SOLUTION: A wired circuit board 100 includes: a transparent substrate 10; a first terminal portion 60 formed on the transparent substrate 10; a second terminal portion 70 formed on the transparent substrate 10; and a wiring layer 50 formed on the transparent substrate 10 so as to connect the first terminal portion 60 and the second terminal portion 70, wherein a slit SL extending continuously from the first terminal portion 60 to the second terminal portion 70 is formed in the wiring layer 50.SELECTED DRAWING: Figure 1 【課題】配線回路基板の配線パターンの自由度を損なうことなく全体的な透明性の向上を可能にする。【解決手段】配線回路基板１００は、透明基板１０と、透明基板１０上に形成された第１の端子部６０と、透明基板１０上に形成された第２の端子部７０と、第１の端子部６０と第２の端子部７０とを接続するように透明基板１０上に形成された配線層５０とを備え、配線層５０に、第１の端子部６０から第２の端子部７０へ連続的に延びるスリットＳＬが形成される。【選択図】図１