ENCAPSULATION COMPOSITION AND SEMICONDUCTOR DEVICE

To provide an encapsulation composition that has excellent fluidity when alumina is used as an inorganic filler.SOLUTION: An encapsulation composition contains an epoxy resin, a curing agent, an inorganic filler containing alumina, and a tertiary phosphine oxide or alumina fluidizing agent.SELECTED...

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Bibliographische Detailangaben
Hauptverfasser:	ISHIBASHI KENTA, YAMAURA ITARU, TANAKA MIKA, KANG DONGOL, HORI KEICHI, KODAMA TAKUYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide an encapsulation composition that has excellent fluidity when alumina is used as an inorganic filler.SOLUTION: An encapsulation composition contains an epoxy resin, a curing agent, an inorganic filler containing alumina, and a tertiary phosphine oxide or alumina fluidizing agent.SELECTED DRAWING: None 【課題】無機充填材としてアルミナを用いた場合における流動性に優れる封止組成物の提供。【解決手段】封止組成物は、エポキシ樹脂と、硬化剤と、アルミナを含む無機充填材と、３級ホスフィンオキシド又はアルミナ流動化剤と、を含有する。【選択図】なし