ENCAPSULATION PROCESS FOR DOUBLE-SIDED COOLED PACKAGES

To provide an encapsulation process for double-sided cooled packages.SOLUTION: One or more electronic devices mounted on a substrate, including at least one cooling plate in contact with the one or more electronic devices, are encapsulated. The substrate is clamped between a first mold half and a se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KUAH TENG HOCK, ANGELITO BARROZO PEREZ, YAN KAR WENG, RAVINDRA RAGHAVENDRA, LIN YI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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