CONDUCTIVE ADHESIVE

To provide a conductive adhesive that is suitably usable for a jet dispenser and has low viscosity, and can maintain a fixed discharge shape and discharge amount, prevents clogging of a nozzle and can be continuously discharged, provides a quickly cured coated film and is excellent in bond strength...

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Bibliographische Detailangaben
1. Verfasser:	FURUYA TETSURO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS DYES ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide a conductive adhesive that is suitably usable for a jet dispenser and has low viscosity, and can maintain a fixed discharge shape and discharge amount, prevents clogging of a nozzle and can be continuously discharged, provides a quickly cured coated film and is excellent in bond strength and electric characteristics of the cured coated film.SOLUTION: A conductive adhesive contains silver powder in which flaky silver powder and spherical silver powder are mixed in a mass ratio of 40:60 to 60:40, an epoxy resin which is composed of an alicyclic epoxy resin and a bisphenol A type liquid epoxy resin, and a curing agent, wherein the content of the silver powder in the conductive adhesive is 75 pts.mass to 85 pts.mass, and the thixotropy value is 2.0-3.0.SELECTED DRAWING: None 【課題】ジェットディスペンサーに好適に使用できる低粘度の導電性接着剤であって、一定の吐出形状及び吐出量を維持することができると共にノズルの目詰まりが起こり難くて連続して吐出することができ、しかも、塗膜の硬化が速く、硬化した塗膜の接合強度及び電気特性に優れる導電性接着剤を提供する。【解決手段】フレーク状銀粉と球状銀粉を質量比４０：６０～６０：４０で混合した銀粉と脂環式エポキシ樹脂とビスフェノールＡ型液状エポキシ樹脂とからなるエポキシ樹脂と硬化剤とを含有する導電性接着剤であり、前記導電性接着剤の前記銀粉の含有量は７５質量部～８５質量部であり、チクソ値が２．０～３．０である導電性接着剤。【選択図】なし