MOUNTING SUBSTRATE AND ELECTRIC DEVICE MOUNTED WITH MOUNTING SUBSTRATE

To provide a mounting substrate capable of improving the heat dissipation property of a printed substrate without deteriorating electrical performance, and an electric device mounted with the mounting substrate.SOLUTION: A mounting substrate includes an electronic component in which a heat dissipati...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUNAGA SATOSHI, NOSAKA NORIMOTO, IWAI SATOSHI, MISHIMA JUNYA, URATA SHINPEI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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