WIRE SAW AND WORKPIECE PROCESSING METHOD USING THE SAME

To provide a wire saw excellent in processing accuracy and processing efficiency, and a workpiece processing method using the same.SOLUTION: A wire saw includes: a plurality of wire guides 5 that are driven to rotate; a wire 3 wound in between the wire guides to form a wire row; a workpiece holding...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKADA MASAAKI, FUKUMAN MASARU, OYA JUN, MURAKAMI HIROKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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