EPOXY RESIN, METHOD FOR PRODUCING THE SAME, EPOXY COMPOSITION CONTAINING THE SAME, AND APPLICATION OF THE SAME

To provide an epoxy resin which improves thermal characteristics of an epoxy system, and exhibits excellent workability, a method for producing the same, a composition containing the same, and application of the same.SOLUTION: There are provided an epoxy resin in which a coefficient of thermal expan...

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Hauptverfasser: KIM YUN JU, PARK SOOK YEON, PARK SU-JIN, CHUN HYUN AEE
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide an epoxy resin which improves thermal characteristics of an epoxy system, and exhibits excellent workability, a method for producing the same, a composition containing the same, and application of the same.SOLUTION: There are provided an epoxy resin in which a coefficient of thermal expansion is lowered by having molecular weight distribution in all of a low molecular weight region and a high molecular weight region, therefore, an upper limit value of the molecular weight is increased up to 2,000,000 at the maximum, and molecular weight distribution having a range of molecular weight distribution of 300-2,000,000 is adjusted; a method for producing the same; and a composition containing the same.SELECTED DRAWING: Figure 1 【課題】エポキシシステムの熱的特性が向上し、優れた加工性を示すエポキシ樹脂、その製造方法、それを含む組成物及びその用途を提供する。【解決手段】低分子量領域と高分子量領域全般にわたる分子量分布を有するようにすることで熱膨張係数を下げる。このため分子量の上限値が最大2,000,000まで増加したものであって、300~2,000,000の分子量分布の範囲を有する分子量分布が調節されたエポキシ樹脂、その製造方法、それを含む組成物を提供する。【選択図】図1