FILM DEPOSITION CONTROL DEVICE, FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD
To provide a film deposition control device for controlling a film deposition condition of a multi-layer thin film so as to obtain a target spectral characteristic.SOLUTION: A film deposition apparatus includes: a light source 42 that irradiates a light to a substrate S arranged on a rotation body 2...
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Zusammenfassung: | To provide a film deposition control device for controlling a film deposition condition of a multi-layer thin film so as to obtain a target spectral characteristic.SOLUTION: A film deposition apparatus includes: a light source 42 that irradiates a light to a substrate S arranged on a rotation body 25; a light receiving part 46 that receives a transmission light transmitting a deposited thin film layer or a reflection light reflecting from the deposited thin film layer for an irradiated light; a position information obtaining part 48 for obtaining position information corresponding to a position of the rotation body; and a control part 4 for controlling a film deposition condition. The control part specifies a substrate position based on the position information obtained in the position information obtaining part. The film deposition apparatus includes: a timing control part for controlling a timing of receiving the transmission light or the reflection light for the substrate; a film thickness judgment part that calculates a film thickness of each layer of a thin film based on the transmission light or the reflection light, and judges a film thickness difference between a film thickness of each layer and a target film thickness; and a film deposition condition setting part that corrects the film deposition condition for each layer so as to obtain the target film thickness and set the film deposition condition when the film thickness of each layer has a film thickness difference being a prescribed value or more to the target film thickness.SELECTED DRAWING: Figure 1
【課題】目的とする分光特性が得られるように多層薄膜の成膜条件を制御する成膜制御装置を提供する。【解決手段】回転体25に配置された基板Sに光を照射する光源42と、照射した光に対し、成膜された薄膜の層を透過する透過光または反射する反射光を受光する受光部46と、回転体の位置に対応した位置情報を取得する位置情報取得部48と、成膜条件を制御する制御部4とを備え、制御部は、位置情報取得部で取得した位置情報に基づいて基板の位置を特定し、基板に対して透過光または反射光を受光するタイミングを制御するタイミング制御部と、透過光または反射光に基づいて薄膜の各層の膜厚を算出し、各層の膜厚と、目標膜厚との膜厚差を判定する膜厚判定部と、各層の膜厚が前記目標膜厚に対して所定値以上の膜厚差がある場合には、目標膜厚になるように当該層に対する成膜条件を補正した上で、成膜条件を設定する成膜条件設定部と、を含む。【選択図】図1 |
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