METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

To provide a method for manufacturing a semiconductor device.SOLUTION: A package structure includes a first placement plate, a seed layer, a plurality of circuits, a die, and a molding material. After a second placement plate is installed in the molding material, the fist placement plate is removed...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHEN CHWAN-TYAW, WANG CHEN-YU, KYO BUNSEI, HO LUNG-HUA, KUO CHIH-MING
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a method for manufacturing a semiconductor device.SOLUTION: A package structure includes a first placement plate, a seed layer, a plurality of circuits, a die, and a molding material. After a second placement plate is installed in the molding material, the fist placement plate is removed to expose the seed layer. Next, the seed layer is removed to expose the circuits, and a gold layer is stored in each circuit in an immersion gold plating method to form a semiconductor device. The gold layer prevents oxidation of each circuit and increases reliability of suitable welding.SELECTED DRAWING: Figure 6 【課題】半導体装置の製造方法を提供する。【解決手段】第一載置板、シード層、複数の回路、ダイ、及び成形材料を含んで構成されるパッケージ構造であって、第二載置板を成形材料に設置した後、第一載置板を除去してシード層を露出する。次いで、シード層を除去してこれら回路を露出し、浸漬金メッキ方式で各回路にゴールドレイヤーを蓄積し、半導体装置を形成する。ゴールドレイヤーは各回路の酸化を防ぐと共に、好適な溶接の信頼性を高める。【選択図】図６