SOLDER JOINT PART AND METHOD FOR MANUFACTURING THE SAME, AND JOINED BODY

To provide a solder joint part which enhances reliability of a joint part for joining members, a manufacturing method capable of simply manufacturing the solder joint part, and a joined body which has improved reliability.SOLUTION: A solder joint part 100 for joining a first member 151 and a second...

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Hauptverfasser: TOMIZUKA KENICHI, ICHIKAWA KOICHI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a solder joint part which enhances reliability of a joint part for joining members, a manufacturing method capable of simply manufacturing the solder joint part, and a joined body which has improved reliability.SOLUTION: A solder joint part 100 for joining a first member 151 and a second member 152 includes a first metal layer 110, and a second metal layer 120 provided on the surface of the first metal layer 110. The first metal layer 110 is a solder layer containing Sn, the second metal layer 120 is a solder layer containing Sn and Bi, and a liquidus temperature of the second metal layer 120 is a temperature lower than a solidus temperature of the first metal layer 110.SELECTED DRAWING: Figure 1 【課題】部材同士を接合する接合部の信頼性がより高められたはんだ接合部、そのはんだ接合部を簡便に製造可能な製造方法、及び信頼性の向上が図られた接合体を提供する。【解決手段】本発明は、第1部材151と第2部材152とを接合するはんだ接合部100であって、第1金属層110と、第1金属層110の表面に設けられた第2金属層120とを備える。第1金属層110は、Snを含むはんだ層であり、第2金属層120は、SnとBiとを含むはんだ層であり、第2金属層120の液相線温度が、第1金属層110の固相線温度に比べて低い温度であることを特徴とする。【選択図】図1