VAPOR DEPOSITION APPARATUS
To provide a vapor deposition apparatus capable of closely contacting a vapor deposition mask to a substrate to form the pattern of a vapor deposition material in the pixel area of the substrate with excellent shape precision.SOLUTION: A vapor deposition apparatus 1 includes: a mask holding part 2 f...
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Zusammenfassung: | To provide a vapor deposition apparatus capable of closely contacting a vapor deposition mask to a substrate to form the pattern of a vapor deposition material in the pixel area of the substrate with excellent shape precision.SOLUTION: A vapor deposition apparatus 1 includes: a mask holding part 2 for holding a vapor deposition mask 7 consisting of a metallic material; a substrate arrangement part 3 for arranging a substrate 11 so as to contact the substrate 11 to the upper surface of the vapor deposition mask 7; a vapor deposition source 4 and a coil 5 arranged below from the vapor deposition mask 7; an AC power supply PU1 for passing the AC current through the coil 5; and a control part CP1 for controlling the operation of the AC power supply PU1. The control part CP1 controls the operation of the AC power supply PU1 so as to generate an AC magnetic field MF1 in the coil 5 by passing the AC current through the coil 5 by the AC power supply PU1 and generate an eddy current in the vapor deposition mask 7 by applying the AC magnetic field MF1 to the vapor deposition mask 7 to float the vapor deposition mask 7 and closely contact to the substrate 11.SELECTED DRAWING: Figure 1
【課題】蒸着マスクを基板に密着させることができ、基板の画素の領域に蒸着材料のパターンを形状精度良く形成することができる蒸着装置を提供する。【解決手段】蒸着装置1は、金属材料よりなる蒸着マスク7を保持するマスク保持部2と、基板11が蒸着マスク7の上面と接するように、基板11を配置する基板配置部3と、蒸着マスク7よりも下方に配置された蒸着源4及びコイル5と、コイル5に交流電流を通流する交流電源PU1と、交流電源PU1の動作を制御する制御部CP1と、を有する。制御部CP1は、交流電源PU1によりコイル5に交流電流を通流することでコイル5に交流磁界MF1を発生させ、交流磁界MF1を蒸着マスク7に印加することで蒸着マスク7内に渦電流を発生させ、蒸着マスク7を浮上させて基板11に密着させるように、交流電源PU1の動作を制御する。【選択図】図1 |
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