WORK CARRIER

To provide a work carrier including a design of an abrasive holding hole that takes into consideration how abrasive flows.SOLUTION: A work carrier 10 has a work holding hole 2 and an abrasive holding hole 3 formed in a carrier substrate 1. On the carrier substrate 1, a holding hole area A, an abrasive supply area C, and a possible area E are set. A ratio of the area of the abrasive supply area C along the circumferential direction of the carrier substrate 1 is defined as an area ratio of the abrasive supply area C, a ratio of the area of the possible area E along the circumferential direction of the carrier substrate 1 is defined as the area ratio of the possible area E, and one of the area ratio of the abrasive supply area C and the area ratio of the possible area E that is smaller at the same radial position on the carrier substrate 1 is defined as a design ratio. The abrasive holding hole 3 is designed based on the design ratio in the ratio of an area determined along the circumferential direction of the carrier substrate 1 for each radial position of the carrier substrate 1, and is formed in the possible area E.SELECTED DRAWING: Figure 1 【課題】研磨剤の流れ方を考慮した研磨剤保持孔がデザインされたワークキャリアを提供すること。【解決手段】キャリア基板１にワーク保持孔２及び研磨剤保持孔３が形成されたワークキャリア１０において、キャリア基板１に保持孔領域Ａと、研磨剤供給領域Ｃと、可能領域Ｅとが設定され、キャリア基板１の周方向に沿う研磨剤供給領域Ｃの面積の割合を研磨剤供給領域Ｃの面積割合とし、キャリア基板１の周方向に沿う可能領域Ｅの面積の割合を可能領域Ｅの面積割合とし、研磨剤供給領域Ｃの面積割合と可能領域Ｅの面積割合とのうち、キャリア基板１の同一の径方向位置において少ない方の面積割合を設計割合とする。そして、研磨剤保持孔３は、キャリア基板１の径方向位置ごとに、キャリア基板１の周方向に沿って求められた面積の割合が設計割合に基づいて設定されると共に、可能領域Ｅに形成される。【選択図】図１