METHOD FOR PROCESSING SUBSTRATE AND SUBSTRATE PROCESSOR

To provide a technique that can optimize electricity removing processing in processing of a substrate.SOLUTION: A method for processing a substrate of a substrate processor includes the steps of: carrying the substrate from a process module for performing plasma processing and electricity removing p...

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Hauptverfasser:	UEMATSU HARUYUKI, ABE MASATOSHI, MIURA TOMOHISA, SUGAWARA TAKESHI, UGAJIN HAJIME
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	To provide a technique that can optimize electricity removing processing in processing of a substrate.SOLUTION: A method for processing a substrate of a substrate processor includes the steps of: carrying the substrate from a process module for performing plasma processing and electricity removing processing, and carrying the substrate to a load rock unit capable of switching an air atmosphere and a vacuum atmosphere; measuring the charge state of the substrate in the load rock state; and optimizing the electricity removing processing by analyzing the result of measuring the state of charge of the substrate.SELECTED DRAWING: Figure 5 【課題】基板の処理における除電処理を最適化させることができる技術を提供する。【解決手段】基板処理装置の基板処理方法であって、プラズマ処理および除電処理を基板に施すプロセスモジュールから前記基板を搬出して、大気雰囲気と真空雰囲気とに切り替え可能なロードロック部に当該基板を搬送する工程と、前記ロードロック部にて前記基板の帯電状態を測定する工程と、前記基板の帯電状態の測定結果を解析して前記除電処理を最適化する工程と、を有する、基板処理方法が提供される。【選択図】図５