MOLD DIE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

To provide a mold die capable of suppressing occurrence of resin waste attaching to an air vent and a method for manufacturing a semiconductor device, in which the mold die is used.SOLUTION: A mold die A10 includes a first die 10 and a second die 20. When the first die 10 and the second die 20 are b...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KIKUCHI TOMOHIRA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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