MOLD DIE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
To provide a mold die capable of suppressing occurrence of resin waste attaching to an air vent and a method for manufacturing a semiconductor device, in which the mold die is used.SOLUTION: A mold die A10 includes a first die 10 and a second die 20. When the first die 10 and the second die 20 are b...
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| creator | KIKUCHI TOMOHIRA |
| description | To provide a mold die capable of suppressing occurrence of resin waste attaching to an air vent and a method for manufacturing a semiconductor device, in which the mold die is used.SOLUTION: A mold die A10 includes a first die 10 and a second die 20. When the first die 10 and the second die 20 are butted in a first direction z, a molding cavity 31 is formed by the first die 10 and the second die 20. The first die 10 is provided with a first air vent 14 which is recessed in the first direction z and connected to the molding cavity 31. The first air vent 14 includes a first portion 141 and a second portion 142. The second portion 142 is connected to the first portion 141. The second portion 142 is located on a side opposite to the molding cavity 31 with the first portion 141 sandwiched therebetween in a second direction x. A size h2 of the second portion 142 in the first direction z is greater than a size h1 of the first portion 141 in the first direction z.SELECTED DRAWING: Figure 4
【課題】 エアベントに付着する樹脂屑の発生を抑制することが可能なモールド金型と、当該モールド金型を用いた半導体装置の製造方法とを提供する。【解決手段】 モールド金型Ａ１０は、第１金型１０および第２金型２０を備える。第１金型１０と第２金型２０とが第１方向ｚに突き合わされると、成形空洞３１が第１金型１０および第２金型２０によって形成される。第１金型１０には、第１方向ｚに凹み、かつ成形空洞３１につながる第１エアベント１４が設けられている。第１エアベント１４は、第１部１４１および第２部１４２を含む。第２部１４２は、第１部１４１につながっている。第２部１４２は、第２方向ｘにおいて第１部１４１を間に挟んで成形空洞３１とは反対側に位置する。第２部１４２の第１方向ｚの寸法ｈ２は、第１部１４１の第１方向ｚの寸法ｈ１よりも大きい。【選択図】 図４ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2023061303A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2023061303A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2023061303A3</originalsourceid><addsrcrecordid>eNrjZLDy9fdxUXDxdFVw9HNR8HUN8fB3UXDzD1LwdfQLdXN0DgkN8vRzVwh29fV09vdzCXUOAcq5uIZ5OrvyMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAyNjAzNDYwNjR2OiFAEA6LYpOQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MOLD DIE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>KIKUCHI TOMOHIRA</creator><creatorcontrib>KIKUCHI TOMOHIRA</creatorcontrib><description>To provide a mold die capable of suppressing occurrence of resin waste attaching to an air vent and a method for manufacturing a semiconductor device, in which the mold die is used.SOLUTION: A mold die A10 includes a first die 10 and a second die 20. When the first die 10 and the second die 20 are butted in a first direction z, a molding cavity 31 is formed by the first die 10 and the second die 20. The first die 10 is provided with a first air vent 14 which is recessed in the first direction z and connected to the molding cavity 31. The first air vent 14 includes a first portion 141 and a second portion 142. The second portion 142 is connected to the first portion 141. The second portion 142 is located on a side opposite to the molding cavity 31 with the first portion 141 sandwiched therebetween in a second direction x. A size h2 of the second portion 142 in the first direction z is greater than a size h1 of the first portion 141 in the first direction z.SELECTED DRAWING: Figure 4
【課題】 エアベントに付着する樹脂屑の発生を抑制することが可能なモールド金型と、当該モールド金型を用いた半導体装置の製造方法とを提供する。【解決手段】 モールド金型Ａ１０は、第１金型１０および第２金型２０を備える。第１金型１０と第２金型２０とが第１方向ｚに突き合わされると、成形空洞３１が第１金型１０および第２金型２０によって形成される。第１金型１０には、第１方向ｚに凹み、かつ成形空洞３１につながる第１エアベント１４が設けられている。第１エアベント１４は、第１部１４１および第２部１４２を含む。第２部１４２は、第１部１４１につながっている。第２部１４２は、第２方向ｘにおいて第１部１４１を間に挟んで成形空洞３１とは反対側に位置する。第２部１４２の第１方向ｚの寸法ｈ２は、第１部１４１の第１方向ｚの寸法ｈ１よりも大きい。【選択図】 図４</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230501&DB=EPODOC&CC=JP&NR=2023061303A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230501&DB=EPODOC&CC=JP&NR=2023061303A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIKUCHI TOMOHIRA</creatorcontrib><title>MOLD DIE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><description>To provide a mold die capable of suppressing occurrence of resin waste attaching to an air vent and a method for manufacturing a semiconductor device, in which the mold die is used.SOLUTION: A mold die A10 includes a first die 10 and a second die 20. When the first die 10 and the second die 20 are butted in a first direction z, a molding cavity 31 is formed by the first die 10 and the second die 20. The first die 10 is provided with a first air vent 14 which is recessed in the first direction z and connected to the molding cavity 31. The first air vent 14 includes a first portion 141 and a second portion 142. The second portion 142 is connected to the first portion 141. The second portion 142 is located on a side opposite to the molding cavity 31 with the first portion 141 sandwiched therebetween in a second direction x. A size h2 of the second portion 142 in the first direction z is greater than a size h1 of the first portion 141 in the first direction z.SELECTED DRAWING: Figure 4
【課題】 エアベントに付着する樹脂屑の発生を抑制することが可能なモールド金型と、当該モールド金型を用いた半導体装置の製造方法とを提供する。【解決手段】 モールド金型Ａ１０は、第１金型１０および第２金型２０を備える。第１金型１０と第２金型２０とが第１方向ｚに突き合わされると、成形空洞３１が第１金型１０および第２金型２０によって形成される。第１金型１０には、第１方向ｚに凹み、かつ成形空洞３１につながる第１エアベント１４が設けられている。第１エアベント１４は、第１部１４１および第２部１４２を含む。第２部１４２は、第１部１４１につながっている。第２部１４２は、第２方向ｘにおいて第１部１４１を間に挟んで成形空洞３１とは反対側に位置する。第２部１４２の第１方向ｚの寸法ｈ２は、第１部１４１の第１方向ｚの寸法ｈ１よりも大きい。【選択図】 図４</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDy9fdxUXDxdFVw9HNR8HUN8fB3UXDzD1LwdfQLdXN0DgkN8vRzVwh29fV09vdzCXUOAcq5uIZ5OrvyMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAyNjAzNDYwNjR2OiFAEA6LYpOQ</recordid><startdate>20230501</startdate><enddate>20230501</enddate><creator>KIKUCHI TOMOHIRA</creator><scope>EVB</scope></search><sort><creationdate>20230501</creationdate><title>MOLD DIE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><author>KIKUCHI TOMOHIRA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023061303A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KIKUCHI TOMOHIRA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIKUCHI TOMOHIRA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MOLD DIE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</title><date>2023-05-01</date><risdate>2023</risdate><abstract>To provide a mold die capable of suppressing occurrence of resin waste attaching to an air vent and a method for manufacturing a semiconductor device, in which the mold die is used.SOLUTION: A mold die A10 includes a first die 10 and a second die 20. When the first die 10 and the second die 20 are butted in a first direction z, a molding cavity 31 is formed by the first die 10 and the second die 20. The first die 10 is provided with a first air vent 14 which is recessed in the first direction z and connected to the molding cavity 31. The first air vent 14 includes a first portion 141 and a second portion 142. The second portion 142 is connected to the first portion 141. The second portion 142 is located on a side opposite to the molding cavity 31 with the first portion 141 sandwiched therebetween in a second direction x. A size h2 of the second portion 142 in the first direction z is greater than a size h1 of the first portion 141 in the first direction z.SELECTED DRAWING: Figure 4
【課題】 エアベントに付着する樹脂屑の発生を抑制することが可能なモールド金型と、当該モールド金型を用いた半導体装置の製造方法とを提供する。【解決手段】 モールド金型Ａ１０は、第１金型１０および第２金型２０を備える。第１金型１０と第２金型２０とが第１方向ｚに突き合わされると、成形空洞３１が第１金型１０および第２金型２０によって形成される。第１金型１０には、第１方向ｚに凹み、かつ成形空洞３１につながる第１エアベント１４が設けられている。第１エアベント１４は、第１部１４１および第２部１４２を含む。第２部１４２は、第１部１４１につながっている。第２部１４２は、第２方向ｘにおいて第１部１４１を間に挟んで成形空洞３１とは反対側に位置する。第２部１４２の第１方向ｚの寸法ｈ２は、第１部１４１の第１方向ｚの寸法ｈ１よりも大きい。【選択図】 図４</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | MOLD DIE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
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