ELECTRONIC COMPONENT BONDING DEVICE

To provide an electronic component bonding device capable of matching, by means of a simple structure, the degrees of parallelization of an electronic component and a substrate, and precisely aligning and bonding electrodes of the electronic component and electrodes of the substrate.SOLUTION: An ele...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	UESHIMA NAOTO, KOTAKE TOSHIYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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