ELECTRONIC COMPONENT BONDING DEVICE

To provide an electronic component bonding device capable of matching, by means of a simple structure, the degrees of parallelization of an electronic component and a substrate, and precisely aligning and bonding electrodes of the electronic component and electrodes of the substrate.SOLUTION: An electronic component bonding device 1 has an electronic component lifting mechanism 11 for moving a bonding tool 33 up and down with respect to a stage 13. The electronic component lifting mechanism 11 has: a high-speed movement mechanism 20 for moving the bonding tool 33 until a distance between an electrode 70 of an electronic component M and an electrode 71 of a substrate P becomes a predetermined distance D1; and a low-speed movement mechanism 21 for moving the bonding tool 33 at a speed lower than that of the high-speed movement mechanism 20. The low-speed movement mechanism 21 has a parallelization degree adjustment mechanism 44 that enables matching the degrees of parallelization of an electronic component holding surface 33a of the bonding tool 33 with respect to a stage surface 13a of the stage 13. The parallelization degree adjustment mechanism 44 is connected by a hemisphere face 65a of a convex spherical face member 65 and a hemisphere face 66a of a concave spherical face member 66.SELECTED DRAWING: Figure 1 【課題】電子部品と基板の平行度合わせを簡単な構造で実現し、電子部品の電極と基板の電極との位置合わせ及び接合を高精度で行うことが可能な電子部品接合装置を実現する。【解決手段】電子部品接合装置１は、ステージ１３に対してボンディングツール３３を昇降移動させる電子部品昇降機構１１を有している。電子部品昇降機構１１は、電子部品Ｍの電極７０と基板Ｐの電極７１との間の距離が所定の距離Ｄ１になるまでボンディングツール３３を移動させる高速移動機構２０と、高速移動機構２０より低い速度でボンディングツール３３を移動させる低速移動機構２１とを有している。低速移動機構２１は、ステージ１３のステージ面１３ａに対しボンディングツール３３の電子部品保持面３３ａの平行度合わせが可能な平行度調整機構４４を有している。平行度調整機構４４は、凸状球面部材６５の半球面６５ａと凹状球面部材６６の半球面６６ａとで接続されている。【選択図】図１