METHOD FOR MANUFACTURING PATTERNED SUBSTRATE

To provide a method for manufacturing a patterned substrate capable of inexpensively manufacturing a patterned substrate having a highly accurate pattern.SOLUTION: A method for manufacturing a patterned substrate includes: a step S1 of forming a resin pattern by printing curable resin on a substrate...

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Bibliographische Detailangaben
Hauptverfasser:	SAITO YUZURU, FUJISHITA AYAKA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COLOUR PRINTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	To provide a method for manufacturing a patterned substrate capable of inexpensively manufacturing a patterned substrate having a highly accurate pattern.SOLUTION: A method for manufacturing a patterned substrate includes: a step S1 of forming a resin pattern by printing curable resin on a substrate; a step S2 of curing the resin pattern; and a step S3 of trimming an edge portion of the resin pattern after curing by irradiation of laser.SELECTED DRAWING: Figure 1 【課題】精度の高いパターンを有するパターン付き基板を安価に製造できるパターン付き基板の製造方法を提供すること。【解決手段】本発明の一態様に係るパターン付き基板の製造方法は、基板に硬化性樹脂を印刷することにより樹脂パターンを形成する工程Ｓ１と、前記樹脂パターンを硬化させる工程Ｓ２と、レーザの照射により、硬化後の前記樹脂パターンの縁部をトリミングする工程Ｓ３と、を備える。【選択図】図１