CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT

To provide a curable resin composition that can form a cured product having excellent peel strength with respect to a conductor layer or the like.SOLUTION: A curable resin composition comprises: a polyphenylene ether comprising a functional group with an unsaturated carbon bond, a silica surface-tre...

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Bibliographische Detailangaben
Hauptverfasser:	MISHIMA SHOKO, ISHIKAWA NOBUHIRO, SEKIGUCHI SHOYA, OSHIRO KOTA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a curable resin composition that can form a cured product having excellent peel strength with respect to a conductor layer or the like.SOLUTION: A curable resin composition comprises: a polyphenylene ether comprising a functional group with an unsaturated carbon bond, a silica surface-treated with a coupling agent comprising a functional group with an unsaturated carbon bond, a silicon compound comprising two or more SiH groups in one molecule, and a peroxide. In the curable resin composition, the content of the silicon compound is 0.1 pt.mass or more and less than 5 pts.mass when the content of the silica is 100 pts.mass.SELECTED DRAWING: None 【課題】導体層等に対して優れたピール強度を有する硬化物を形成可能な硬化性樹脂組成物を提供する。【解決手段】不飽和炭素結合を有する官能基を含むポリフェニレンエーテルと、不飽和炭素結合を有する官能基を含むカップリング剤で表面処理されたシリカと、１分子中に２つ以上のＳｉＨ基を有するケイ素化合物と、過酸化物とを含む硬化性樹脂組成物であって、前記硬化性樹脂組成物は、前記シリカの含有量を１００質量部とした場合の前記ケイ素化合物の含有量が０．１質量部以上５質量部未満である、硬化性樹脂組成物。【選択図】なし